Overall heat dissipation performance of silicon nitride ceramic substrate

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In today’s rapidly developing power electronic devices towards high power density and miniaturization integration, heat dissipation has become a core bottleneck restricting system reliability and performance improvement. Silicon nitride ceramic substrate (Si ∝ N ₄) is known as the “hexagonal warrior” in ceramic substrate materials due to its thermal expansion coefficient close to that of silicon carbide substrate, thermal conductivity of over 90 W/(m · K), and excellent mechanical strength exceeding 800 MPa. It not only solves the pain points of low thermal conductivity of traditional alumina substrates and insufficient mechanical reliability of aluminum nitride substrates, but also provides long-lasting and stable heat dissipation support and electrical insulation for IGBT, MOSFET, and new energy vehicle electronic control systems under extreme working conditions of high temperature, high voltage, and strong corrosion.

FAQ: How can silicon nitride ceramic substrates solve your thermal management challenges?
Q: As power density increases, the circuit board frequently overheats, leading to system derating or even failure. What should be done?
Answer: Our silicon nitride ceramic substrate has a maximum thermal conductivity of 90-110W/(m · K), which can quickly conduct the chip junction temperature to the heat sink, ensuring that the device operates in a safe temperature range for a long time and solving the problem of “thermal congestion”.
Q: How to avoid the risk of open circuit caused by ceramic substrate cracking under severe vibration and thermal shock environment?
Answer: Silicon nitride is the only structural ceramic that combines high thermal conductivity and high toughness, with fracture toughness>6.5MPa · m ¹/², bending strength>700MPa, excellent thermal shock resistance, and can perfectly adapt to the harsh working conditions of new energy vehicles and high-speed rail traction motors.

Excellent heat dissipation performance: not just high thermal conductivity
The reason why silicon nitride ceramic substrates stand out among many electronic packaging materials is that they achieve the ultimate balance between thermal and mechanical properties.

Core advantages of the product
-Ultra high thermal conductivity: Through the use of high-temperature (>2000 ° C) sintering technology and special lattice structure design, the theoretical thermal conductivity potential of silicon nitride ceramics has been fully explored. At present, the thermal conductivity of mainstream products remains stable at 80-110 W/(m · K), effectively reducing interfacial thermal resistance and enabling rapid heat conduction in the vertical direction.
-Perfect matching of thermal expansion coefficient: Its thermal expansion coefficient (2.5-3.2 × 10 ⁻⁶/℃) is highly matched with third-generation semiconductor silicon carbide (SiC) and gallium nitride (GaN) chips, greatly reducing solder layer delamination failure caused by thermal stress during power cycling.
-High insulation and voltage resistance: The insulation and voltage resistance strength exceeds 20kV/mm, and the volume resistivity is as high as 10 ¹⁴Ω· cm, ensuring electrical safety even in high voltage and high humidity environments.

Flexible full-size customization service
We are well aware that standard parts cannot meet all precision design requirements. Therefore, we provide full process customization services from material formulation to molding process:
-Geometric dimensions: Supports thicknesses of 0.25mm, 0.32mm, 0.635mm, 1.0mm and other specifications, with customizable length and width ranging from 114.3mm x 114.3mm to 190.5mm x 138mm, and even larger irregular parts.
-Surface treatment: Provides double-sided grinding and polishing services, with surface roughness controlled within Ra 0.3-0.6 μ m, meeting the requirements of high-precision thin film circuit wiring.
-Metalization process: Combined with mature active metal brazing (AMB) process, it ensures high bonding strength between copper foil and ceramic substrate, and excellent resistance to cold and hot impact.

Customer Application Cases
Case: IGBT module heat dissipation upgrade for a leading new energy vehicle electronic control system
-Facing demand: The new generation 800V high-voltage electronic control platform developed by the customer has a 30% reduction in volume compared to the previous generation, but with a significant increase in power density. Although the originally used aluminum nitride substrate had good thermal conductivity, in actual road tests, the thermal shock caused by frequent acceleration and deceleration of the motor resulted in microcracks on the aluminum nitride substrate, leading to a decrease in the insulation and voltage resistance of the module. The customer urgently needs a substrate material that combines high thermal conductivity and high reliability.
-Solution: We recommend high thermal conductivity silicon nitride ceramic substrates (thermal conductivity>90W/(m · K)) to our customers and produce them according to their designed 0.32mm thickness and customized shape. This scheme utilizes the fracture toughness of silicon nitride, which is twice that of aluminum nitride, to resist thermal stress and mechanical vibration.
-Final effect:
-Reliability leap: After 3000 power cycle tests (-40 ° C to 150 ° C), there were no cracks on the silicon nitride substrate, and the module failure rate was reduced by 80%.
-Optimization of heat dissipation efficiency: Thanks to the high thermal conductivity of the material and the matching coefficient of thermal expansion, the junction temperature of the IGBT chip is reduced by about 15 ° C compared to the original solution. Under the same operating conditions, a larger current is allowed to pass, which improves the power output capability of the electronic control system.

If you are looking for ceramic substrates that can balance high thermal conductivity, high strength, and stable domestic supply, please feel free to consult now! You only need to provide drawings or performance requirements, and our engineering team will provide you with one-stop technical support from material selection to application, helping your product stand out in the fierce market competition.

Brudeze Ceramics supplies and sells a wide range of high-quality quartz glass, including alumina ceramics, zirconia ceramics, silicon nitride ceramics, aluminum nitride ceramics, silicon carbide ceramics, boron carbide ceramics, bioceramics, machinable ceramics, etc. We can meet the customization requirements of various ceramic products.