Aluminum oxide ceramic circuit board

Aluminum oxide ceramic circuit board (Al ₂ O ∝ Ceramic PCB) is an electronic packaging substrate that uses high-purity aluminum oxide ceramic as the substrate, deposits a metal conductive layer on its surface through thin film or thick film technology, and etches precision circuits. With its excellent insulation, matching thermal expansion coefficient with chips, and stable mechanical strength, it is recognized as the “golden cornerstone” in the fields of high-power electronic devices, high-frequency communication, and highly reliable hybrid integrated circuits.

Product FAQ
Q: What should I do if my high-power LED or IGBT module has poor heat dissipation, resulting in performance degradation or failure?
Answer: Our alumina ceramic circuit board has a stable thermal conductivity of 24-29 W/m · K, which can quickly transfer heat from the chip to the substrate, effectively reducing thermal resistance and solving the problem of heat dissipation bottleneck.
Q: In high-frequency communication, signal transmission is prone to delay or attenuation. How to ensure signal integrity?
Answer: This product uses 99.6% high-purity alumina, with a stable dielectric constant of 9.8-9.9 (@ 1MHz) and extremely low dielectric loss, which can significantly reduce the delay and distortion of high-frequency signal transmission and ensure circuit performance.
Q: The circuit board of the device is prone to delamination or cracking under cold and hot shock environments. How can we ensure long-term reliability?
Answer: The thermal expansion coefficient of alumina ceramics (6.7-7.0 × 10 ⁻⁶/K) is very close to that of silicon chips, and the bending strength is over 400MPa, which can effectively suppress fatigue failure caused by thermal stress and greatly extend the service life of equipment.

Core advantages of the product

1. Excellent physical and electrical performance
   Aluminum oxide ceramic circuit boards not only have extremely high insulation strength and volume resistivity (>10 ¹⁴Ω· cm), but also have excellent surface smoothness. Through precision grinding or polishing processes, the surface roughness (Ra) can be as low as 0.025 μ m, making it highly suitable for thin film circuit processes and meeting high-precision wiring requirements.
2. Flexible and diverse customization capabilities
   We understand that every application scenario is unique. Therefore, we offer fully customized services:
   -Specification and size: Supports substrates ranging from microchip carriers to large-sized 152.4mm × 152.4mm, with thicknesses ranging from 0.1mm to 4.0mm.
   -Film layer design: Multiple electrode/resistor film layers such as NiCr Au, TiW Au, TaN can be customized to meet different welding or bonding requirements.
   -Graphic accuracy: The minimum line width/spacing can be controlled below 0.05mm, supporting high-density interconnect design.

Product application areas
-Optical communication and high-frequency devices: As transmission substrates, they ensure low loss characteristics of signals during high-speed transmission.
-Power electronic module: used for PTC heaters, IGBT modules, and high-power LED packaging in new energy vehicles to solve heat dissipation pain points.
-Hybrid Integrated Circuit: Suitable for thick film/thin film hybrid ICs, chip resistor arrays, universal isolators, etc.

Customer Application Cases
Case: RF front-end module of a well-known communication equipment manufacturer (anonymous)
-Project requirement: The customer needs to find a substrate in the RF front-end module of a 5G base station. The substrate must have extremely low dielectric loss in a high-frequency working environment (>10GHz) and quickly dissipate the heat generated by the high-power amplifier to maintain system stability.
-Solution: We have customized 99.6% alumina film circuit substrates for our customers. By using surface polishing technology to reduce roughness to below 0.02 μ m and designing a matching TiW Pt Au metallization system, it not only meets the requirements of fine microstrip line layout but also ensures the strength of gold wire bonding.
-Final effect: According to customer testing, after using this substrate, the signal insertion loss of the RF module was reduced by 15%, the overall operating temperature of the module decreased by 8 ℃, and it passed the rigorous -55 ℃ to+125 ℃ thermal cycle test. At present, the plan has entered the stage of bulk supply.

If you are facing challenges in heat dissipation or signal transmission, please feel free to provide your design drawings or specific requirements at any time, and we will customize a sample aluminum oxide ceramic circuit board solution for you.

Brudeze Ceramics supplies and sells a wide range of high-quality quartz glass, including alumina ceramics, zirconia ceramics, silicon nitride ceramics, aluminum nitride ceramics, silicon carbide ceramics, boron carbide ceramics, bioceramics, machinable ceramics, etc. We can meet the customization requirements of various ceramic products.