Valores de conductividad térmica y otras aplicaciones del nitruro de aluminio

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In the modern electronics industry, semiconductor, and high-end manufacturing fields, the thermal management capability of materials directly determines the performance, reliability, and lifespan of products. Among numerous heat dissipation materials, aluminum nitride (AlN) ceramics stand out due to their excellent thermal conductivity, becoming a key material for solving the problem of high power density heat dissipation. This article will objectively and systematically analyze the thermal conductivity of aluminum nitride, and deeply explore its applications, advantages, and customer cases.

Thermal conductivity of aluminum nitride: data and theory
Thermal conductivity is the core physical quantity that measures the ability of a material to conduct heat. The most striking feature of aluminum nitride is its extremely high theoretical thermal conductivity, reaching up to 170-200 W/(m · K). This value is much higher than that of aluminum oxide (Al2O3, about 30 W/(m · K)), and is comparable to commonly used metal heat dissipation materials such as aluminum (about 200 W/(m · K)), and even surpasses aluminum under certain conditions.
However, it should be noted that the thermal conductivity of actual products is significantly affected by factors such as purity, grain boundaries, oxygen content, and sintering aids. Through advanced powder preparation and pressure sintering technology, we are able to produce high-quality aluminum nitride ceramic substrates and structural components with a stable thermal conductivity of over 170 W/(m · K), fully leveraging their theoretical advantages in our products.

Why does aluminum nitride have such high thermal conductivity?
This is mainly attributed to its crystal structure. Aluminum nitride is a covalent bonding compound with a wurtzite structure, and the average free path of phonons (the main carrier of heat) in its lattice is long, with minimal scattering, allowing for highly efficient heat transfer within it.

Core application scenarios: What key problems are solved?
With high thermal conductivity, high insulation, thermal expansion coefficient matched with silicon, and excellent mechanical strength, aluminum nitride ceramics have solved the bottlenecks that traditional materials find difficult to overcome in the following fields:

1. High power LED packaging
   Problem solved: High power LED chips generate a huge amount of heat. If the heat cannot be exported in a timely manner, it will lead to increased light attenuation, color temperature drift, and a sudden decrease in lifespan.
   Product application: As a ceramic substrate for LED (such as COB packaging), aluminum nitride can quickly conduct the heat generated by the chip to the heat sink, ensuring that the LED operates in an efficient and stable state.
2. Semiconductors and Integrated Circuits
   Problem solving: As the chip process enters the nanometer level, power density increases dramatically, and “thermal failure” becomes one of the main failure modes of integrated circuits.
   Product application: Used as an insulation and heat dissipation substrate, widely used in IGBT modules, laser diodes (LD), RF microwave circuits, etc. It can control the junction temperature of core components within a safe range, greatly improving system reliability.
3. Automotive Electronics and New Energy Vehicles
   Problem solving: The electronic control system, main drive inverter, on-board charger and other components of new energy vehicles work in harsh environments, with extremely high requirements for heat dissipation and insulation.
   Product application: Aluminum nitride heat sinks and ceramic circuit boards are used for packaging power modules, helping electric vehicles operate stably in high temperature environments and extending the life of batteries and electronic control systems.
4. Aeroespacial y defensa
   Problem solving: These fields have extreme requirements for the volume, weight, and reliability of electronic devices, requiring materials to maintain stable performance in harsh environments.
   Product application: Used for high-density multi chip modules, phased array radar T/R modules, etc., providing excellent heat dissipation and signal transmission integrity.

Product advantages: Why choose our aluminum nitride solution?
When choosing aluminum nitride products, our solution provides comprehensive advantages:
Ultimate thermal management performance: The thermal conductivity of the aluminum nitride material we provide is stable at the industry’s high-end level (>170 W/(m · K)), making it the first choice for solving extreme heat dissipation problems.
Excelente aislamiento eléctrico: High resistivity ensures safety and signal stability in high-voltage and high-frequency applications.
The thermal expansion coefficient matched with silicon effectively alleviates the stress between the chip and substrate caused by thermal cycling, prevents cracking and delamination, and improves product durability.
Excellent mechanical strength and processability: Despite its high hardness, we can provide various complex shaped aluminum nitride structural components through precision machining to meet your customized needs.
High purity and consistency: We strictly control every step from raw materials to finished products, ensuring highly consistent performance between product batches and safeguarding your mass production stability.

Aluminum nitride ceramics are becoming a key material for promoting the development of high-power and high-density electronic technology due to their irreplaceable high thermal conductivity and other comprehensive excellent properties. Choosing the right aluminum nitride products and partners is an important part of ensuring that your products maintain a leading edge in fierce competition.

Cerámica Brudeze suministra y vende una amplia gama de vidrio de cuarzo de alta calidad, incluyendo cerámica de alúmina, cerámica de circonio, cerámica de nitruro de silicio, cerámica de nitruro de aluminio, cerámica de carburo de silicio, cerámica de carburo de boro, biocerámica, cerámica mecanizable, etc. Podemos satisfacer los requisitos de personalización de varios productos cerámicos.