Metallized ceramic circle

Metallized ceramic circles are high-performance composite material products that combine ceramic materials with metal coatings. It forms a strong bond between the metal layer and the ceramic substrate by coating a thin metal film on the ceramic surface and subjecting it to high-temperature sintering or other processing techniques. This material combines the high hardness, wear resistance, insulation, and high temperature resistance of ceramics with the conductivity, thermal conductivity, and weldability of metals, and is widely used in fields such as electronics, aerospace, automotive, and medical.

Product characteristics

  1. High bonding strength
    -Metallized ceramic circles are processed through special techniques to ensure a high bonding strength between the metal layer and the ceramic substrate, capable of withstanding mechanical and thermal stresses.
  2. Excellent conductivity and thermal conductivity
    -The metallization layer usually uses highly conductive metals such as copper, silver, and gold, which can provide excellent conductivity and thermal conductivity to meet the heat dissipation needs of high-power electronic devices.
  3. High precision machining
    -By using advanced photolithography, etching and other processes, high-precision circuit patterns can be achieved, with a line width accuracy of up to 20-30 μ m, suitable for packaging microelectronic devices.
  4. High temperature resistance and thermal shock resistance
    -Ceramic matrix has excellent high temperature resistance and can maintain stability in extreme temperature environments, while the metallization layer also has good thermal shock resistance.
  5. Good insulation performance
    -Ceramic materials themselves have high insulation strength and can maintain good insulation performance even after metallization, making them suitable for high-voltage and high-power electronic devices.

Application area

  1. Electronic field
    -Used for manufacturing high-frequency circuit substrates, power device heat dissipation boards, LED packaging substrates, etc., to meet the heat dissipation and insulation requirements of high-power and high-density electronic devices.
  2. Aerospace
    -Suitable for electronic component packaging in high temperature and high reliability environments, such as traveling wave tubes, vacuum arc extinguishing chambers, etc.
  3. Automotive Electronics
    -Widely used in IGBT modules, power modules, etc. of new energy vehicles, providing excellent heat dissipation and insulation performance.
  4. Medical equipment
    -Used for manufacturing insulation components and high-frequency components in medical equipment, such as X-ray tubes, ceramic insulators, etc.

Customized service
Metallized ceramic circles can be customized according to specific customer needs, including size, shape, metallization layer material, circuit patterns, etc. We provide comprehensive services from design to production to ensure that our products meet the personalized needs of our customers.

As a high-performance composite material, metalized ceramic circles have become an indispensable key material in modern electronics, aerospace and other fields due to their excellent physical and chemical properties and wide application prospects. We are committed to providing customers with high-quality metalized ceramic products and customized solutions to support the development of high-end manufacturing industry.