Encapsulation test aluminum nitride ceramic suction nozzle

1、 Product Introduction
Aluminum nitride ceramic suction nozzle for packaging testing is a high-performance ceramic component designed specifically for semiconductor packaging testing equipment. It is made of high-purity aluminum nitride (AlN) material and has the following significant characteristics:
-High thermal conductivity: The thermal conductivity of aluminum nitride ceramics can reach over 200W/m · K, which is much higher than traditional alumina ceramics. It can quickly conduct and disperse heat, effectively reducing the thermal stress of chips during packaging and testing.
-High insulation performance: Aluminum nitride ceramics have excellent electrical insulation properties, high resistivity, low dielectric loss, and can ensure electrical stability in high voltage and high frequency environments.
-High hardness and wear resistance: Its hardness exceeds that of traditional alumina ceramics, and its surface is not easily worn during frequent adsorption and handling, resulting in a long service life.
-High temperature resistance and thermal stability: The maximum working temperature of aluminum nitride ceramics can reach 800 ° C, and the thermal expansion coefficient matches that of silicon wafers, which can maintain dimensional stability in high temperature environments and reduce the impact of thermal deformation on packaging accuracy.
-Chemical corrosion resistance: Aluminum nitride ceramics have good corrosion resistance to various chemicals, especially to molten aluminum, and are suitable for complex chemical environments in semiconductor manufacturing.

2、 Application Fields
Aluminum nitride ceramic suction nozzles for packaging testing are widely used in semiconductor packaging testing equipment, with specific application scenarios as follows:
-Chip packaging: During the chip packaging process, it is used to adsorb and transport chips, ensuring precise positioning and stable transmission of chips during the packaging process. Its high thermal conductivity and insulation can effectively protect the chip from thermal damage and electrical interference.
-Wafer handling: During wafer manufacturing and testing, aluminum nitride ceramic suction nozzles can be used to adsorb and move wafers. Its high temperature resistance and chemical corrosion resistance enable it to maintain stable performance in processes such as wafer cleaning and etching.
-High precision packaging equipment: suitable for packaging testing equipment that requires extremely high precision and reliability, such as flip chip packaging equipment, 3D packaging equipment, etc. The high hardness and wear resistance of aluminum nitride ceramic suction nozzles can ensure long-term stable operation of the equipment.
-Optical communication and high-power LED packaging: Aluminum nitride ceramic suction nozzles can also be used for packaging testing of optical communication devices and high-power LEDs. Its high thermal conductivity and low dielectric loss characteristics can meet the heat dissipation and electrical insulation requirements of these devices under high-power and high-density packaging conditions.

3、 Customization Details
Aluminum nitride ceramic suction nozzles for packaging testing can be customized according to specific customer needs, including:
-Customization of size and shape: Different sizes and shapes of suction nozzles can be customized according to the equipment parameters and process requirements provided by the customer. For example, circular, square, or other special shaped nozzles to accommodate different chip or wafer sizes.
-Customization of pore size and hole type: Customize suction nozzles with different pore sizes and hole types according to adsorption and handling requirements. For example, microporous nozzles can be used for the adsorption of high-precision, small-sized chips, while macroporous nozzles are suitable for the handling of larger sized wafers.
-Customization of surface treatment: Provide different surface treatment methods, such as polishing, sandblasting, etc. The polished nozzle has a high surface finish, which can reduce friction and damage during the adsorption process; Sandblasting treatment can increase the roughness of the nozzle surface and improve the adsorption force.
-Customization of machining accuracy: Provide high-precision machining services according to customers’ precision requirements. For example, for high-precision packaging equipment, the size accuracy of the suction nozzle can be controlled at the micrometer level to ensure its stability and reliability in complex processes.
-Customization process: Customers can provide drawings or samples, and the manufacturer will design, process, and test according to their needs. The customization process includes powder granulation, forming, sintering, precision processing, testing, and cleaning to ensure that the quality and performance of the product meet customer requirements.

Aluminum nitride ceramic suction nozzle for packaging testing has become an indispensable key component in the field of semiconductor packaging testing due to its excellent performance and extensive customization capabilities. Its high thermal conductivity, high insulation, high hardness, and high temperature resistance can meet the strict requirements for accuracy, stability, and reliability in the semiconductor manufacturing process. Meanwhile, customized services can ensure a perfect match between the suction nozzle and the customer’s equipment and process, providing strong support for the development of the semiconductor industry.

Brudeze Ceramics supplies and sells a wide range of high-quality quartz glass, including alumina ceramics, zirconia ceramics, silicon nitride ceramics, aluminum nitride ceramics, silicon carbide ceramics, boron carbide ceramics, bioceramics, machinable ceramics, etc. We can meet the customization requirements of various ceramic products.