XC4VLX40-11FFG668C Compact Package: 1152-FBGA (35x35mm) footprint

Compact Package: 1152-FBGA (35x35mm) footprint optimizes board space

The device's combination of logic density

Product attributes Property Value Manufacturer Cologne Chip Product Series GateMate™ Packaging Tray | Tray Number of LABs/CLBs - Number of Logic Elements/Cells 20480 Total RAM Bits 1310720 Number of I/O 162 Number of Gates - Voltage - Supply 0

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XC4VLX40-11FFG668C Compact Package: 1152-FBGA (35x35mm) footprintProduct attributes Property Value Manufacturer AMD Product Series Virtex 4 LX Packaging Tray Tray Number of LABs CLBs 4608 Number of Logic Elements Cells 41472 Total RAM Bits 1769472 Number of I O 448 Number of Gates Voltage Supply 1. 14V ~ 1. 26V Mounting Type Surface Mount Operating Temperature 0C ~ 85C (TJ) Grade Qualification Package Case 668 BBGA, FCBGA Supplier Device Package 668 FCBGA (27x27) ROHS