XCZU17EG-2FFVD1760I GHI Electronics 112 I/O Pins: Extensive connectivity

112 I/O Pins: Extensive connectivity options for interfacing with multiple peripherals and systems

Industrial-Grade Reliability: -40°C to 85°C operating temperature range for harsh environments

DMA and WDT peripherals for efficient data transfer and system monitoring

The flash-based architecture of the A3P030-2QNG68 offers significant advantages over SRAM-based FPGAs

XCZU17EG-2FFVD1760I GHI Electronics 112 I/O Pins: Extensive connectivityAMD Zynq UltraScale+ MPSoC EG XCZU17EG 2FFVD1760I The XCZU17EG 2FFVD1760I is a high performance System on Chip (SoC) combining ARM processing power with advanced FPGA fabric, ideal for demanding embedded applications in aerospace, automotive, industrial automation, medical devices, and telecommunications. Key Features: Processing Power: Quad ARM Cortex A53 MPCore (1. 3GHz) + Dual ARM Cortex R5 + ARM Mali 400 MP2 GPU FPGA Fabric: 926K+ programmable