Processing of large diameter aluminum nitride flakes

In today’s era of pursuing higher power, faster speed, and smaller size electronic devices, the demand for high-performance heat dissipation materials is becoming increasingly urgent. Aluminum nitride (AlN) has become an indispensable key material in semiconductor packaging, high-power devices, and high-temperature electronic applications due to its excellent thermal conductivity, good insulation, high mechanical strength, and good compatibility with silicon substrates. However, processing aluminum nitride into thin sheets with large diameters, uniform thickness, and smooth surfaces is a technically challenging process. We focus on providing high-quality large-diameter aluminum nitride sheet processing services to meet your demanding application needs.

Large diameter aluminum nitride flakes are ultra-thin plate-like materials that are precisely cut, ground, and polished from high-purity aluminum nitride ingots or billets using advanced processing technology.
Main features:
Excellent thermal conductivity: The thermal conductivity of aluminum nitride can reach 150-220 W/m · K (the specific value depends on the material purity and density), far higher than traditional aluminum oxide (Al ₂ O3) substrates, which can quickly and effectively conduct the heat generated by high-power devices, significantly improving the reliability and service life of the devices.
Excellent insulation performance: Aluminum nitride has extremely high electrical resistivity (usually greater than 10 ¹⁴Ω· cm) and dielectric strength (usually greater than 10 MV/m), making it an ideal electrical insulation material that can effectively isolate circuits and prevent short circuits.
Good mechanical strength and hardness: Aluminum nitride has high bending strength and hardness, can withstand certain mechanical stresses, and is not easily broken during processing and use.
Low coefficient of thermal expansion (CTE): Its coefficient of thermal expansion (approximately 4.0-4.8 × 10 ⁻⁶/K) is very close to that of silicon (Si), which greatly reduces the stress caused by thermal mismatch in high-temperature working environments and effectively prevents chip cracking or delamination.
Good chemical stability: It has excellent corrosion resistance to most acids and bases and stable chemical properties.
High processing accuracy: The large-diameter aluminum nitride sheets we provide have strict thickness tolerance control (up to ± 0.01mm or even higher), excellent surface parallelism and flatness, meeting the requirements of precision electronic assembly. The surface can be roughly ground, finely ground, or polished according to the needs.
‘Large diameter’ usually refers to thin sheets with a diameter of 100mm or more, even up to 300mm, 450mm or larger, to meet the needs of large substrates, heat dissipation plates or special packaging.

Application:
Semiconductor Packaging Substrate and Interconnection: As a packaging substrate for high-power LEDs, power semiconductors (such as IGBT, SiC, GaN devices), MEMS sensors, etc., it provides excellent heat dissipation paths and electrical insulation, while also serving as a carrier for circuit interconnection.
High power electronic device heat dissipation board/cover plate: directly used for heat dissipation of high-power transistors, modules, etc., efficiently exporting heat and ensuring that the device operates within a safe temperature range.
High frequency circuit substrate: Utilizing its low dielectric constant and low dielectric loss characteristics, it is used as a substrate material for making high-frequency circuits such as microwave and millimeter wave, reducing signal transmission losses.
Laser heat sink: In high-power laser diode (LD) modules, as a heat sink material, it effectively dissipates the large amount of heat generated during laser operation and maintains stable laser performance.
High temperature electronic devices: applied to electronic devices and systems that require operation at higher temperatures (such as 200 ° C or above).
Aerospace and Defense: Used for manufacturing high-performance, high reliability electronic components and heat dissipation structures in harsh space and military environments.
Medical equipment: used in medical electronic devices that require high precision, high stability, and good biocompatibility.

Customization details:
Size customization:
Diameter: Thin sheets can be processed according to requirements, ranging from standard sizes (such as 100mm, 150mm, 200mm, 300mm, 450mm) to larger non-standard sizes.
Thickness: Provides a variety of thickness options ranging from tens of micrometers to a few millimeters, and can be precision machined according to customer specified thickness, with tolerances controlled within ± 0.01mm, ± 0.005mm, or even better.
Shape: In addition to standard circular sheets, square, rectangular, or other shaped sheets can also be processed according to the drawing.
Customized surface treatment:
Surface roughness: It can provide rough grinding surface (Ra about 0.4-1.6 μ m), fine grinding surface (Ra about 0.1-0.4 μ m) or high-precision polishing surface (Ra can be as low as 0.01-0.02 μ m), meeting different assembly and performance requirements.
Double sided/Single sided processing: Single sided or double-sided grinding/polishing can be selected according to needs.
Edge processing: It can provide edge chamfering, rounding, or precision cutting to prevent edge stress concentration and damage.
Material specification customization:
Purity: Different purity levels of aluminum nitride raw materials (such as ≥ 99%, ≥ 99.5%, ≥ 99.9%) can be selected to meet different requirements for thermal conductivity and electrical insulation performance.
Density and grain structure: Aluminum nitride materials with different sintering densities and grain sizes can be selected according to specific application requirements.
Tolerance control:
Parallelism: The parallelism between the two surfaces of the thin film can be controlled within a very strict range (such as ± 0.01mm).
Flatness: The flatness of the thin film surface can be controlled at the micrometer level.
Warping degree: Control the warping deformation of the sheet within the minimum range.

Large diameter aluminum nitride flakes are a key foundational material for promoting the development of high-power and high-frequency electronic technology. We are committed to providing you with large-diameter aluminum nitride sheets with excellent performance, precise dimensions, and perfect surfaces through our professional processing technology, strict quality control system, and flexible customization services.

Brudeze Ceramics supplies and sells a wide range of high-quality quartz glass, including alumina ceramics, zirconia ceramics, silicon nitride ceramics, aluminum nitride ceramics, silicon carbide ceramics, boron carbide ceramics, bioceramics, machinable ceramics, etc. We can meet the customization requirements of various ceramic products.