Aluminum nitride compression ring is a ring-shaped component made of aluminum nitride ceramic material.
Main features:
High thermal conductivity: much higher than other common ceramics such as alumina and silicon nitride, close to one-third of copper metal, and can effectively dissipate heat.
Low dielectric constant and low dielectric loss: suitable for high-frequency applications, with low signal transmission loss.
Good insulation: high electrical resistivity and high dielectric strength.
Good chemical stability: corrosion resistance, high temperature resistance, and can maintain good mechanical and insulation properties even at high temperatures.
Good thermal compatibility with silicon wafers: The coefficient of thermal expansion (CTE) is very close to that of silicon (Si), which can effectively reduce stress caused by thermal expansion and contraction, and improve device reliability.
High hardness: has good wear resistance.
Pressure rings are usually used for fixing, sealing, insulation, or heat dissipation purposes. Aluminum nitride compression rings combine the excellent properties of aluminum nitride with the structural characteristics of compression rings, making them particularly suitable for applications that require efficient heat dissipation, good insulation, and structural support.
Application of Aluminum Nitride Compression Ring
Aluminum nitride compression rings have been widely used in various high-tech fields due to their unique properties, including:
In the field of semiconductor packaging:
Chip fixation and heat dissipation: In power modules (such as IGBT modules, MOSFET modules) and LED packages, it is used as a part of the substrate, base, or heat sink. The pressure ring can fix the chip or heat sink in a designated position, while utilizing the high thermal conductivity of AlN to quickly dissipate the heat generated by the chip.
Insulation isolation: In high voltage or applications that require electrical isolation, the pressure ring can provide mechanical support while ensuring electrical insulation.
Microwave and RF devices:
Sealing and support of cavity: In microwave filters, power amplifiers and other devices, AlN pressure rings can be used to seal the cavity, fix internal components, and their low dielectric loss characteristics are conducive to signal transmission.
High power electronic devices:
Devices such as laser diodes (LDs), high brightness LEDs, and power electronic devices generate a large amount of heat during operation. AlN pressure rings can effectively assist in heat dissipation, improving the stability and lifespan of the devices.
Sensors and actuators:
In some sensors or actuators that require high temperature resistance, insulation, and certain structural strength, AlN pressure rings can be used to fix sensitive components or actuating parts.
Aerospace and military industries:
Due to its high temperature resistance, high reliability, excellent insulation and heat dissipation performance, AlN compression rings have strict requirements for material properties and can be used for electronic devices or structural components in special environments.
Customized description of aluminum nitride compression ring
Aluminum nitride compression rings are usually customized products to meet specific application requirements. When customizing, the following key parameters and requirements need to be described:
Basic dimensions:
Inner diameter (ID): The diameter of the inner circle of the pressure ring.
Outer diameter (OD): The outer diameter of the compression ring.
Height/Thickness: The axial dimension of the compression ring.
Tolerance requirements: Accuracy requirements for dimensions such as ID, OD, height, etc. (such as ± 0.01mm, ± 0.05mm, etc.).
Geometric shapes and features:
Sectional shape: Is it uniform wall thickness, or does it have a taper, step, or other special shape?
Chamfering/Rounding: Whether the edges need to be chamfered or rounded to prevent scratches or stress concentration.
Through hole/blind hole: Is it necessary to process installation holes, positioning holes, or other functional holes on the pressure ring? The diameter, position, depth, quantity, etc. of the holes.
Thread: Is it necessary to machine threads on the inner and outer walls or end faces?
Keyways or other mating features: Special structures that may be required according to assembly requirements.
Surface treatment requirements:
Surface roughness (Ra): Specify the roughness level that the surface needs to achieve based on assembly or appearance requirements.
Coating: Is it necessary to apply coating treatment on the surface? For example, gold plating (Au), silver plating (Ag), nickel plating (Ni), etc. are used to improve conductivity, weldability, or corrosion resistance.
Other treatments: such as grinding, polishing, etc.
Material specifications:
AlN purity: Is there a requirement for the purity of aluminum nitride?
Additives: Do specific sintering aids or other additives need to be used to adjust performance.
Thermal conductivity index: Is there a specific numerical requirement for the thermal conductivity of the final product.
Brudeze Ceramics supplies and sells a wide range of high-quality quartz glass, including alumina ceramics, zirconia ceramics, silicon nitride ceramics, aluminum nitride ceramics, silicon carbide ceramics, boron carbide ceramics, bioceramics, machinable ceramics, etc. We can meet the customization requirements of various ceramic products.
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